Subject: The Company's Board of Directors approved the issuance of unsecured corporate bond
Date of events:2023/05/11
Contents:
1.Date of the board of directors resolution:2023/05/11
2.Name [issue no.__ of (secured, unsecured) corporate bonds of
___________ (company)]:
Hon Hai Precision Industry Co., Ltd. unsecured corporate bond issue
3.Whether to adopt shelf registration (Yes/No):No
4.Total amount issued: Aggregate amount not exceeding NTD45,000,000,000
(can be issued at once or in installments)
5.Face value per bond:NTD1,000,000
6.Issue price: At par
7.Issuance period:
Depends on market condition, may with same or different tenors
8.Coupon rate: Fixed coupon rate to be determined at pricing
9.Types, names, monetary values and stipulations of collaterals: NA
10.Use of the funds raised by the offering and utilization plan:
Debt repayment and / or working capital replenishment
11.Underwriting method: Public offering by underwriter
12.Trustees of the corporate bonds: To be decided
13.Underwriter or agent: To be decided
14.Guarantor(s) for the issuance: NA
15.Agent for payment of the principal and interest: To be decided
16.Certifying institution: NA
17.Where convertible into shares, the rules for conversion: NA
18.Sell-back conditions: NA
19.Buyback conditions: NA
20.Reference date for any additional share exchange, stock swap, or
subscription: NA
21.Possible dilution of equity in case of any additional share exchange,
stock swap, or subscription: NA
22.Any other matters that need to be specified: None