Acquisition

IQE PLC 22 December 2006 22 December 2006 IQE plc IQE secures position as leading supplier of advanced wafers to the global wireless industry with £7.5m acquisition in Singapore IQE plc ('IQE', 'the Group', AIM: IQE), the UK-based leading outsource supplier of advanced wafers and outsource wafer services to the global semiconductor industry, has agreed to acquire MBE Technology Pte Ltd ('MBE'), a Singapore based manufacturer of compound epitaxial ('epi') wafers for a total cash consideration of S$23 million (£7.5 million). This acquisition will be immediately earnings enhancing and completes the Group's strategy to become the largest supplier of epi-wafers into chip manufacturers for the global wireless industry. The enlarged Group will have the industry's broadest range of current and next generation products, together with enhanced purchasing power for raw materials. The addition of MBE to the Group will also provide significant opportunities to accelerate IQE's sales into existing and new customers in the major markets of the Pacific Rim region. The Group has also published separately a trading update for the year to 31 December 2006. Consideration and funding The consideration is based on an initial payment of S$11.5 million (£3.8 million) in cash and a further S$11.5 million (£3.8 million) by the issue to the vendor of loan notes bearing interest of 6.5%. The loan notes are repayable in three instalments in January 2008, June 2008 and January 2009. Noble & Company Limited has placed 25 million new ordinary IQE shares ('New Ordinary Shares') at 18p per share to raise approximately £4.5 million (before expenses) to finance the cash consideration payable on completion of the acquisition and working capital (the 'Placing'). The New Ordinary Shares will be admitted to trading on AIM on 27 December 2006. MBE Technology MBE, incorporated in Singapore 1993, is one of the leading independent global manufacturers of compound semiconductor epi-wafers for use in very high-speed electronic components in the wireless and optical telecommunications industries. It has state-of-the-art facilities in Singapore and a strong team of management and employees. In 2006, MBE is expected to generate revenues in the order of US$15 million and an EBITDA of over US$ 3.2 million. MBE's growth and premier position are sustained by its strong customer base across the Far East including a strategic supplier agreement with a substantial Japanese electronics manufacturer. Acquisition Rationale The acquisition positions IQE as the largest outsource supplier worldwide of epi wafers to the global wireless industry. It will provide IQE with a very strong presence in Asia including excellent links into Japan, Taiwan, China and Korea. IQE intends to use the new base in Asia to aggressively sell into the Pacific Rim wireless industry. IQE will now have a dual-source manufacturing capability for all its wireless products with facilities in Singapore, the US, and the UK qualified for the production of wafers for RF components. The Board believe this will enable the Group to offer its customers effectively risk free sourcing of wafers. The acquisition is expected to increase the Group's purchasing power of raw materials and the utilisation of IQE's other facilities as demand, particularly from the Pacific Rim countries, continues to grow. Industry background The wireless industry continues to grow extremely rapidly driven by increasing mobile handset sales and the addition of WiFi, WiMAX and wireless media. Consumers are demanding increased functionality, with faster access, any time, anywhere and more comprehensive interactive content. This is creating a huge demand for faster, more sophisticated handsets. These higher data rate and more sophisticated handsets and wireless systems require much more use of Gallium Arsenide wafers, IQE's leading product offering. According to Strategic Analytics, the amount of Gallium Arsenide wafers used in mobile phones alone is expected to at least double between 2005 and 2009. Dr Drew Nelson, IQE Chief Executive, said: 'The earning enhancing acquisition of MBE, with its strong product and customer base, coupled with its very powerful regional presence provides IQE with clear global leadership in the supply of advanced wafer products to the worldwide wireless industry. 'Following the acquisition of EMD in August, we have now completed our strategy of becoming the leading supplier of wafers to the global wireless industry, providing all the required wafer technologies. 'MBE provides us with a Far East base for the aggressive penetration of the major markets of the Pacific Rim, particularly Japan, China, Taiwan and Korea. It also means that the Group now has a second source for the manufacture of all wafer products for the wireless industry. This brings significant manufacturing synergies, allowing us to more fully leverage our global purchasing power and excess manufacturing capacity at our facilities in the US. 'IQE is the only wafer company capable of supplying products for the full spectrum of the wireless market, from handset to infrastructure. We can provide our customers with complete assurance of supply and a one stop shop for all of their wafer requirements - we are uniquely well positioned to play a leading role the rapid growth of the global wireless market.' Enquiries: IQE plc www.iqep.com. Dr Drew Nelson, Chief Executive Stuart Hall, Chief Finance Officer Chris Meadows, Investor Relations Noble & Company Limited +44(0) 20 7763 2200 John Llewellyn-Lloyd/ Sam Reynolds College Hill Adrian Duffield/Ben Way +44 (0) 20 7457 2020 Placing Details IQE has conditionally raised approximately £4.5 million (before expenses) through a placing of 25,000,000 new ordinary shares at 18p per share. The Placing is conditional, inter alia, on admission (''Admission'') of the New Ordinary Shares to trading on AIM, a market operated by London Stock Exchange plc (the ''London Stock Exchange'') ('AIM') (which is the market on which the Company's existing issued ordinary shares are admitted to trading) occurring by no later than 27 December 2006. The New Ordinary Shares are equivalent to approximately 6 per cent. of the Company's enlarged ordinary share capital following Admission and the Placing Price represents a discount of approximately 4 per cent. to the closing mid-market price of an existing issued ordinary share of 18.75p on 21 December 2006, the latest practicable date prior to the posting of this announcement. Application has been made for the admission of the New Ordinary Shares to trading on AIM. The shares will rank pari passu with the existing ordinary shares of the Company. Dealings in the New Ordinary Shares are expected to commence on 27 December 2006. Note to Editors IQE is the leading global outsource supplier of advanced semiconductor wafers, with products that cover the whole spectrum of wafer structures, supported by an innovative outsourced foundry services portfolio that allows the Group to provide a 'one stop shop' for the wafer needs of the world's leading semiconductor manufacturers IQE uses advanced crystal growth technology (epitaxy) to manufacture and supply bespoke semiconductor wafers ('epi-wafers') to the major chip manufacturing companies, who then use these wafers to make the chips which form the key components of virtually all high technology systems. IQE is unique in being able to supply wafers using all of the leading crystal growth technology platforms. IQE's products are found in many leading edge consumer, communication, computing and industrial applications, including a complete range of wafer products for the wireless industry, including mobile handsets and wireless infrastructure, WiFi, WiMAX, base stations, GPS, and satellite communications; optical communications, optical storage (CD, DVD), laser optical mouse, laser printers & photocopiers, thermal imagers, leading edge medical products, barcode, high efficiency LEDs and a variety of advanced silicon based systems. These manufacturers are increasingly seeking to outsource wafer production to specialist foundries such as IQE, in order to reduce overall wafer costs and accelerate time to market. IQE provides bespoke R&D services to deliver customised materials for specific applications and offers specialist technical staff to manufacture to specification either at its own facilities or on the customer's own sites. The Group is also able to leverage its global purchasing volumes to reduce the cost of raw materials. In this way IQE's outsourced services, provide compelling benefits in terms of flexibility and predictability of cost, thereby significantly reducing operating risk. Following the acquisition, IQE will employ around 320 people and operate six manufacturing facilities located in Cardiff (two) and Milton Keynes in the UK, and in Bethlehem, Pennsylvania and Somerset, New Jersey in the USA, and Singapore. The Group also has nine sales offices located in major economic centres worldwide. Glossary Epiwafer: A wafer of semiconducting material (made by a crystal growth process called epitaxy) for use in the manufacture of microelectronic devices. Two methods of growing the epitaxial layer on existing silicon or other wafers are currently used: metal organic chemical vapour deposition (MOCVD) and molecular beam epitaxy (MBE). These wafers are typically newer types of semiconductors comprising some combination of the elements gallium, indium, aluminum, nitrogen, phosphorus or arsenic. Semiconductor: A solid whose electrical conductivity can be controlled over a wide range, either permanently by introducing impurities ('doping') or dynamically by applying electric fields. Semiconductor devices with dynamically controlled conductivity are the building blocks of integrated circuits, such as microprocessors. Semiconductors may be elemental materials such as silicon and germanium, or compound semiconductors which comprise more than one element such as gallium arsenide or alloys such as silicon germanium or aluminium gallium arsenide. Wafer: a thin slice of semiconducting material upon which microcircuits are constructed. Wafers are thus of key importance in the fabrication of semiconductor devices such as integrated circuits. Typically they are made in various sizes ranging from 1 inch (25.4 mm) to 11.8 inches (300 mm), and thicknesses of the approximately 0.5 mm. RF: Radio Frequency components such as amplifiers, receivers and modulators, which are designed to operate in the microwave and wireless ranges of the electromagnetic spectrum. This information is provided by RNS The company news service from the London Stock Exchange

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